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Toshiba – MG50Q2YS50 – IGBT Half-Bridge Power Module – 1200V 50A – Reclaimed Part

Manufacturer

OEM Part Number

MG50Q2YS50

GPS Part Number

27-TOS-MG50Q2YS50

Tags

Price:

$145.89

Specifications
Voltage WPC AH/kVA Length Width Height Weight
1200 V N/A 50 A N/A N/A N/A ≈  150  g
Voltage 1200 V
WPC N/A
Amp/H 50 A
Length N/A
Width N/A
Height N/A
Weight ≈  150  g

Toshiba — MG50Q2YS50 IGBT Power Module 1200 V • 50 A • Complete Half-Bridge • 2 N-Channel IGBTs with Built-In Freewheel Diodes • Isolated Baseplate
What it is

The Toshiba MG50Q2YS50 is a 1200 V, 50 A silicon N-channel IGBT power module designed for high-power switching and motor-control applications. Toshiba integrates a complete half-bridge into one package, combining two IGBT switching elements with built-in reverse-connected freewheel diodes.

The MG50Q2YS50 combines high input impedance, high-speed switching and electrically isolated power terminals in a compact industrial module. It is well suited to motor drives, industrial inverters, UPS systems and other high-voltage power-conversion equipment requiring a complete IGBT half-bridge.

At-a-Glance
  • Voltage Rating: 1200 V VCES
  • Current Rating: 50 A @ TC = 80°C; 78 A @ TC = 25°C
  • Topology: Complete half-bridge / 2U configuration
  • Switching Devices: 2 N-channel IGBTs with built-in freewheel diodes
  • Pulse Current: 100 A @ 80°C; 156 A @ 25°C, 1 ms
  • VCE(sat): 2.8 V typ. / 3.6 V max @ 50 A, 25°C
  • Isolation: 2500 V AC / 1 minute
  • Package: Toshiba 2-94D4A • Approx. 202 g
Features
  • Complete half-bridge — two IGBT switching elements integrated into one industrial power module.
  • 1200 V blocking capability — designed for high-voltage inverter and motor-control applications.
  • High-speed switching — fall time rated at 0.3 µs maximum under specified inductive-load conditions.
  • Low saturation voltage — VCE(sat) 2.8 V typical / 3.6 V maximum at 50 A and 25°C.
  • Built-in freewheel diodes — reverse-connected diodes integrated with the IGBT switching elements.
  • High input impedance — insulated-gate construction simplifies gate-drive requirements.
  • Electrically isolated case — power electrodes are isolated from the case for simplified heatsink integration.
Technical Specifications
Parameter Value
Manufacturer Toshiba
Part Number MG50Q2YS50
Device Type Silicon N-channel IGBT power module
Configuration Complete half-bridge / 2U
Collector-Emitter Voltage (VCES) 1200 V
Gate-Emitter Voltage (VGES) ±20 V
Collector Current (IC) 78 A @ TC = 25°C; 50 A @ TC = 80°C
Pulse Collector Current (ICP) 156 A @ 25°C; 100 A @ 80°C, 1 ms
Forward Diode Current (IF) 50 A
Peak Forward Diode Current (IFM) 100 A, 1 ms
Collector-Emitter Saturation Voltage 2.8 V typ. / 3.6 V max @ IC = 50 A, VGE = 15 V, Tj = 25°C
Collector-Emitter Saturation Voltage @ 125°C 3.1 V typ. / 4.0 V max @ IC = 50 A, VGE = 15 V
Gate Leakage Current (IGES) ±500 nA max @ VGE = ±20 V
Collector Cut-Off Current (ICES) 1.0 mA max @ VCE = 1200 V
Gate-Emitter Cut-Off Voltage 3.0–6.0 V @ IC = 50 mA, VCE = 5 V
Input Capacitance (Cies) 6.0 nF typ. @ VCE = 10 V, f = 1 MHz
Switching Fall Time (tf) 0.3 µs max under specified inductive-load conditions
Collector Power Dissipation (PC) 400 W @ TC = 25°C
Maximum Junction Temperature 150°C
Storage Temperature −40°C to +125°C
Isolation Voltage 2500 V AC / 1 minute
Terminal / Mounting Torque 3 N·m / 3 N·m
Package Toshiba 2-94D4A
Mass Approx. 202 g
Configuration Two IGBT elements forming one complete half-bridge
Applications / Replacement Considerations
Module Representative Applications Replacement Notes
MG50Q2YS50 Industrial motor drives; UPS inverters; AC drives; power converters; high-voltage switching systems Verify the 1200 V rating, current rating at the intended case temperature, complete half-bridge topology, gate-drive requirements, terminal arrangement, mechanical fit and cooling before substitution.
Why Buy from Gruber
  • Power electronics expertise — Decades of experience supporting UPS, inverter and critical-power systems.
  • Legacy component support — Hard-to-find and obsolete Toshiba IGBT modules for maintaining legacy equipment.
  • Replacement assistance — Help matching IGBT topology, electrical ratings, gate-drive requirements and mechanical fit for legacy power equipment.