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$80.00
| Voltage | WPC | AH/kVA | Length | Width | Height | Weight |
|---|---|---|---|---|---|---|
| 1200 V | N/A | 200 A | N/A | N/A | N/A | 430 g |
| Voltage | 1200 V |
| WPC | N/A |
| Amp/H | 200 A |
| Length | N/A |
| Width | N/A |
| Height | N/A |
| Weight | 430 g |
1200Â V, 200Â A dual IGBT power module for high-power inverters, UPS bridges, and motor drives.
Integrated fast free-wheel diodes and a 2.5Â kVRMS insulated baseplate simplify thermal and EMC design.
| Parameter | Value |
| Manufacturer | Powerex / Toshiba |
| Part Number | MG200Q2YS65H |
| Device Type | Dual IGBT half-bridge with antiparallel fast diodes |
| Collector-Emitter Voltage (VCES) | 1200Â V |
| Collector Current (IC) | 200 A (DC, Tc=25 °C); 400 A (1 ms pulse) |
| Forward Current (diode) | 200Â A DC; 400Â A (1Â ms pulse) |
| Collector Power Dissipation (PC) | 1310 W @ Tc=25 °C |
| VCE(sat) (typ./max) | 3.0 V typ @ 200 A, 25 °C; 3.6 V typ @ 200 A, 125 °C; 4.0 V max |
| Gate-Emitter Voltage (max) | ±20 V |
| Gate Threshold / Leakage | VGE(off) 4.0–7.0 V; IGES ≤ ±500 nA |
| Capacitance (typ.) | Cies ≈ 17 nF (VCE=10 V, 1 MHz) |
| Switching (typ.) | td(on) 0.05 µs; tr 0.05 µs; td(off) 0.55 µs; tf 0.05–0.15 µs |
| Switching Energy (typ.) | Eon 20 mJ; Eoff 17 mJ @ VCC=600 V, IC=200 A, VGE=±15 V, RG=4.7 Ω, Tc=125 °C |
| Diode (typ./max) | VF 2.4/3.5 V @ 200 A; trr 0.1 µs (IF=200 A) |
| Thermal Resistance | Rth(j-c)(IGBT) 0.095 °C/W; Rth(j-c)(Diode) 0.21 °C/W |
| Isolation / Torque / Mass | 2.5 kVRMS/1 min; terminals & mounts 3 N·m; ≈ 430 g |
| Operating / Storage | Tj −40…+150 °C; Tstg −40…+125 °C |
| Package / Footprint | Dual 2-in-one module; standard screw terminals; isolated copper baseplate |
| Configuration | Dual (2-pack half-bridge) |
| Module | Applications | Notes |
| MG200Q2YS65H | UPS inverter/rectifier bridges; high-power motor drives; industrial inverters | Observe 3 N·m torque, 2.5 kV isolation, and specified switching/thermal limits. |