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$126.00
| Voltage | AH/kVA | Length | Width | Height | Weight |
|---|---|---|---|---|---|
| 1200 V | 300 A | N/A | N/A | N/A | ≈ 750 g |
| Voltage | 1200 V |
| Amp/H | 300 A |
| Length | N/A |
| Width | N/A |
| Height | N/A |
| Weight | ≈ 750 g |
1200Â V / 300Â A dual half-bridge IGBT module used in UPS, drives and high-power SMPS. Non-punch-through (NPT) IGBT die with fast, soft CAL free-wheel diodes in a low-inductance SEMITRANSÂ 3 housing; insulated DCB base simplifies heatsinking and grounding.
| Parameter | Value |
| Collector-Emitter Voltage (VCES) | 1200Â V |
| Continuous Collector Current (IC) | 300 A @ Tc=25 °C; 210 A @ Tc=80 °C |
| Repetitive Peak Collector Current (ICRM) | 400Â A |
| Gate-Emitter Voltage (VGES) | ±20 V |
| Short-circuit withstand (tpsc) | 10 µs (typ. conditions) |
| Diode Forward Current (IF) | 260 A @ Tc=25 °C; 180 A @ Tc=80 °C |
| Repetitive Peak Diode Current (IFRM) | 400Â A |
| Surge Diode Current (IFSM) | 1800 A, 10 ms, sin., Tj=150 °C |
| Module IRMS | 500Â A |
| Junction / Storage Temp. | −40…+150 °C / −40…+125 °C |
| Isolation Voltage | 4000Â VAC, 1Â min |
| VCE(sat) @ IC=200Â A, VGE=15Â V | typ. 3.3Â V, max 3.85Â V |
| rCE (on) @ VGE=15 V | 9 mΩ (25 °C)  / 11.5 mΩ (125 °C) |
| Input/Output/Reverse Capacitances | Cies 18–24 nF; Coes 2.5–3.2 nF; Cres 1.0–1.3 nF |
| Total Gate Charge (Qg) | ≈ 2000 nC |
| ton / tr (VCC=600 V, IC=200 A, RGon=3 Ω) | ≈ 130 ns / 40 ns |
| toff / tf (Tj=125 °C, RGoff=3 Ω) | ≈ 460 ns / 30 ns |
| Eon / Eoff @ 200 A | ≈ 16 mJ / 30 mJ |
| Rth(j-c) (per IGBT) | 0.075Â K/W |
| Package / Dimensions | SEMITRANS 3 — 106×62×31 mm |
| Configuration | Dual IGBT half-bridge (7-pin) with antiparallel diodes |
| Module | Applications | Notes |
| SKM300GB125D | UPS; SMPS; induction/resonant heating; welders; motor drives | Observe isolation and thermal specs; torque per SEMITRANSÂ 3 guidelines; use appropriate gate resistors. |