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$108.00
| Voltage | WPC | AH/kVA | Length | Width | Height | Weight |
|---|---|---|---|---|---|---|
| 600 V | N/A | 75 A | N/A | N/A | N/A | ≈  150 g |
| Voltage | 600 V |
| WPC | N/A |
| Amp/H | 75 A |
| Length | N/A |
| Width | N/A |
| Height | N/A |
| Weight | ≈  150 g |
The Toshiba MG75J2YS40 is a 600 V, 75 A IGBT power module designed for high-power switching and motor-control applications. The module contains two N-channel IGBT switching elements in a series-connected, center-tap configuration with built-in freewheel diodes, forming a complete half-bridge power stage.
Designed for industrial power conversion, the MG75J2YS40 combines high input impedance, fast switching and integrated freewheel diodes in a compact flange-mount package. Representative applications include industrial motor drives, UPS inverters, DC choppers, power converters and other high-current switching systems.
| Parameter | Value |
| Manufacturer | Toshiba |
| Part Number | MG75J2YS40 |
| Device Type | N-channel IGBT power module with built-in diodes |
| Configuration | Series-connected, center-tap, 2 elements / complete half-bridge |
| Collector-Emitter Voltage (VCES) | 600 V |
| Gate-Emitter Voltage (VGES) | ±20 V |
| Continuous Collector Current (IC) | 75 A |
| Pulse Collector Current (ICP) | 150 A, 1 ms |
| Continuous Forward Current (IF) | 75 A |
| Peak Forward Current (IFM) | 150 A, 1 ms |
| Maximum VCE(sat) | 3.5 V |
| Maximum Fall Time (tf) | 0.35 µs |
| Collector Power Dissipation | 390 W @ TC = 25°C |
| Maximum Junction Temperature | 150°C |
| Storage Temperature | −40°C to +125°C |
| Isolation Voltage | 2500 V AC / 1 minute |
| Terminal Torque | 3 N·m |
| Mounting Torque | 3 N·m |
| Number of Elements | 2 |
| Number of Terminals | 7 |
| Package Style | Rectangular flange-mount power module |
| Module | Representative Applications | Replacement Notes |
| MG75J2YS40 | Industrial motor drives; UPS inverters; DC choppers; power converters; industrial switching systems | Verify the 600 V rating, 75 A current rating, 2U half-bridge configuration, gate-drive requirements, terminal arrangement, mechanical fit and cooling before substitution. |



